| contributor author | Yu-Jung Huang | |
| contributor author | Shen-Li Fu | |
| date accessioned | 2017-05-09T00:02:12Z | |
| date available | 2017-05-09T00:02:12Z | |
| date copyright | June, 2000 | |
| date issued | 2000 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26181#115_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123555 | |
| description abstract | This paper introduces an algorithm that focuses on the placement of the power dissipating chips for multichip module applications. The main design issue is addressed on the chip placement to achieve uniform thermal distribution. Our approach to the placement problem is based on the modified force-directed placement method. The proposed thermal force-directed placement method is to relate the force equations to the power dissipation values of the individual bare chip. Examples of multichip placement are presented. The finite element simulation results are also investigated and compared with quadrisection placement methods. [S1043-7398(00)01002-1] | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermal Placement Design for MCM Applications | |
| type | Journal Paper | |
| journal volume | 122 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.483142 | |
| journal fristpage | 115 | |
| journal lastpage | 120 | |
| identifier eissn | 1043-7398 | |
| keywords | Force | |
| keywords | Energy dissipation | |
| keywords | Algorithms | |
| keywords | Design | |
| keywords | Finite element analysis | |
| keywords | Integrated circuits | |
| keywords | Equations AND Simulation results | |
| tree | Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 002 | |
| contenttype | Fulltext | |
