| contributor author | K. Verma | |
| contributor author | B. Han | |
| date accessioned | 2017-05-09T00:02:11Z | |
| date available | 2017-05-09T00:02:11Z | |
| date copyright | September, 2000 | |
| date issued | 2000 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26184#227_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123540 | |
| description abstract | Far infrared Fizeau interferometry is developed and it is proposed as a tool for warpage measurement of microelectronics devices. The method provides a whole-field map of surface topography with a basic measurement sensitivity of 5.31 μm per fringe contour. The method is implemented by a compact apparatus using a computer controlled environmental chamber for real-time measurement. The method retains the simplicity of classical interferometry while providing wide applicability to dielectric rough surfaces. Roughness tolerance is achieved by utilizing a far infrared light (λ=10.6 μm). The detailed optical and mechanical configuration is described and selected applications are presented to demonstrate the applicability. The unique advantages of the method are discussed. [S1043-7398(00)01303-7] | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry1 | |
| type | Journal Paper | |
| journal volume | 122 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1286315 | |
| journal fristpage | 227 | |
| journal lastpage | 232 | |
| identifier eissn | 1043-7398 | |
| keywords | Interferometry | |
| keywords | Surface roughness | |
| keywords | Warping | |
| keywords | Microelectronic devices | |
| keywords | Infrared radiation AND Manufacturing | |
| tree | Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 003 | |
| contenttype | Fulltext | |
