| contributor author | Yutaka Tsukada | |
| contributor author | Masao Sakane | |
| contributor author | Masateru Ohnami | |
| contributor author | Hideo Nishimura | |
| date accessioned | 2017-05-09T00:02:11Z | |
| date available | 2017-05-09T00:02:11Z | |
| date copyright | September, 2000 | |
| date issued | 2000 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26184#207_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123537 | |
| description abstract | This paper describes the life assessment of flip chip joints. Flip chip joints of 63Sn-37Pb and 5Sn-95Pb solders on a printed circuit board were stressed thermally for fatigue. Fatigue lives of the joints were determined by an electrical potential drop method and the effect of encapsulation on fatigue life was discussed. The encapsulation had a significant effect of prolonging the fatigue life of the joints. Thermo-mechanical finite element analyses proved that the encapsulation lowered the strain amplitude of the joints by distributing the strain over a whole package and bending effect. Cracking location was also discussed in relation with the strain concentration in the joints. Fatigue lives of the flip chip joints were compared with those of bulk round bar specimens and the difference in fatigue life between two types of specimens was discussed from the specimen dimensions and ratchet effect. [S1043-7398(00)00203-6] | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Fatigue Life Analysis of Solder Joints in Flip Chip Bonding | |
| type | Journal Paper | |
| journal volume | 122 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1286002 | |
| journal fristpage | 207 | |
| journal lastpage | 213 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Bonding | |
| keywords | Electrical resistance | |
| keywords | Fatigue life | |
| keywords | Finite element model | |
| keywords | Solder joints | |
| keywords | Flip-chip | |
| keywords | Finite element methods | |
| keywords | Fatigue | |
| keywords | Stress | |
| keywords | Fracture (Process) | |
| keywords | Drops | |
| keywords | Dimensions | |
| keywords | Electric potential | |
| keywords | Temperature AND Cycles | |
| tree | Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 003 | |
| contenttype | Fulltext | |
