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contributor authorXiaowu Zhang
contributor authorS-W. Ricky Lee
contributor authorYi-Hsin Pao
date accessioned2017-05-09T00:02:11Z
date available2017-05-09T00:02:11Z
date copyrightSeptember, 2000
date issued2000
identifier issn1528-9044
identifier otherJEPAE4-26184#200_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/123536
description abstractThermal fatigue of solder joints is critical to the performance and reliability of electronic components. It is well known that the fatigue life of solder joints is rather difficult to be estimated because of the complicated material behaviors and solder joint geometry. Conventional life prediction methods such as Coffin-Manson equation or its modifications usually over-estimate the thermal fatigue life. The main reason for this phenomenon is that the material properties are assumed constant during thermal cycling. In this paper, a damage evolution model is introduced for predicting the thermal fatigue life of solder joints. This method not only considers the degradation of material properties in the solder, but also saves substantial computational effort. In the present study, a damage function is determined by the hysteresis loops of creep shear stress-strain of solder joints in a double-beam specimen. The proposed model is then applied to investigate the solder joint reliability of a 272 PBGA package and a bottom-leaded plastic (BLP) package for model verification. The results from the present analysis seem to be encouraging. [S1043-7398(00)01003-3]
publisherThe American Society of Mechanical Engineers (ASME)
titleA Damage Evolution Model for Thermal Fatigue Analysis of Solder Joints
typeJournal Paper
journal volume122
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1286121
journal fristpage200
journal lastpage206
identifier eissn1043-7398
keywordsCreep
keywordsSolders
keywordsMaterials properties
keywordsFatigue life
keywordsSolder joints
keywordsStress
keywordsFatigue analysis
keywordsGeometry
keywordsCycles
keywordsManufacturing
keywordsShear (Mechanics)
keywordsFinite element analysis AND Equations
treeJournal of Electronic Packaging:;2000:;volume( 122 ):;issue: 003
contenttypeFulltext


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