contributor author | Xiaowu Zhang | |
contributor author | S-W. Ricky Lee | |
contributor author | Yi-Hsin Pao | |
date accessioned | 2017-05-09T00:02:11Z | |
date available | 2017-05-09T00:02:11Z | |
date copyright | September, 2000 | |
date issued | 2000 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26184#200_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123536 | |
description abstract | Thermal fatigue of solder joints is critical to the performance and reliability of electronic components. It is well known that the fatigue life of solder joints is rather difficult to be estimated because of the complicated material behaviors and solder joint geometry. Conventional life prediction methods such as Coffin-Manson equation or its modifications usually over-estimate the thermal fatigue life. The main reason for this phenomenon is that the material properties are assumed constant during thermal cycling. In this paper, a damage evolution model is introduced for predicting the thermal fatigue life of solder joints. This method not only considers the degradation of material properties in the solder, but also saves substantial computational effort. In the present study, a damage function is determined by the hysteresis loops of creep shear stress-strain of solder joints in a double-beam specimen. The proposed model is then applied to investigate the solder joint reliability of a 272 PBGA package and a bottom-leaded plastic (BLP) package for model verification. The results from the present analysis seem to be encouraging. [S1043-7398(00)01003-3] | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | A Damage Evolution Model for Thermal Fatigue Analysis of Solder Joints | |
type | Journal Paper | |
journal volume | 122 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1286121 | |
journal fristpage | 200 | |
journal lastpage | 206 | |
identifier eissn | 1043-7398 | |
keywords | Creep | |
keywords | Solders | |
keywords | Materials properties | |
keywords | Fatigue life | |
keywords | Solder joints | |
keywords | Stress | |
keywords | Fatigue analysis | |
keywords | Geometry | |
keywords | Cycles | |
keywords | Manufacturing | |
keywords | Shear (Mechanics) | |
keywords | Finite element analysis AND Equations | |
tree | Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 003 | |
contenttype | Fulltext | |