| contributor author | John H. Lau | |
| contributor author | ASME Fellow | |
| contributor author | S.-W. Ricky Lee | |
| date accessioned | 2017-05-09T00:02:10Z | |
| date available | 2017-05-09T00:02:10Z | |
| date copyright | December, 2000 | |
| date issued | 2000 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26186#306_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123521 | |
| description abstract | Solder joint reliability of flip chip on various thickness of printed circuit board with imperfect underfill is presented in this study. Emphasis is placed on the determination of the temperature-dependent stress and plastic strain at the corner solder joint with different crack (delamination) lengths. Also, the strain energy release rate and phase angle at the crack tip of the interface between the underfill and solder mask are obtained by fracture mechanics. [S1043-7398(00)01104-X] | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills | |
| type | Journal Paper | |
| journal volume | 122 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1289998 | |
| journal fristpage | 306 | |
| journal lastpage | 310 | |
| identifier eissn | 1043-7398 | |
| keywords | Fracture mechanics | |
| keywords | Solders | |
| keywords | Stress | |
| keywords | Fracture (Materials) | |
| keywords | Corners (Structural elements) | |
| keywords | Masks | |
| keywords | Solder joints | |
| keywords | Flip-chip assemblies | |
| keywords | Delamination | |
| keywords | Flip-chip | |
| keywords | Reliability | |
| keywords | Temperature AND Thickness | |
| tree | Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 004 | |
| contenttype | Fulltext | |
