| contributor author | W. Ren | |
| contributor author | D. Shangguan | |
| contributor author | Z. Qian | |
| contributor author | M. Lu | |
| contributor author | S. Liu | |
| date accessioned | 2017-05-08T23:59:20Z | |
| date available | 2017-05-08T23:59:20Z | |
| date copyright | December, 1999 | |
| date issued | 1999 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26175#271_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/121984 | |
| description abstract | The thermomechanical behaviors of a new lead free solder and eutectic 63Sn37Pb are investigated in this paper. A series of tests including tensile, creep, and fatigue, are carried out on a computer controlled 6-axis mini-fatigue tester. The thin strip specimen is used in this research, which is specially designed and verified to be suitable for the testing of solder alloys and comparable to the data from the literature. Based on the experimental study, the new lead free solder alloy shows very attractive characteristics and may have potential applications in electronics packaging products. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Investigation of a New Lead Free Solder Alloy Using Thin Strip Specimens | |
| type | Journal Paper | |
| journal volume | 121 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2793851 | |
| journal fristpage | 271 | |
| journal lastpage | 274 | |
| identifier eissn | 1043-7398 | |
| keywords | Alloys | |
| keywords | Lead-free solders | |
| keywords | Strips | |
| keywords | Fatigue | |
| keywords | Creep | |
| keywords | Solders | |
| keywords | Electronic packaging | |
| keywords | Testing AND Computers | |
| tree | Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 004 | |
| contenttype | Fulltext | |
