| contributor author | J. Lau | |
| contributor author | T. Chen | |
| contributor author | S.-W. R. Lee | |
| date accessioned | 2017-05-08T23:59:20Z | |
| date available | 2017-05-08T23:59:20Z | |
| date copyright | December, 1999 | |
| date issued | 1999 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26175#242_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/121980 | |
| description abstract | The effect of heat-spreader sizes on the temperature distribution, thermal resistance, and cooling power of a set of cost-effective cavity-down plastic ball grid array (PBGA) packages assembled on a FR-4 epoxy glass printed circuit board (PCB) is presented. The sizes of these packages are 35 × 35 mm and 40 × 40 mm with 4 and 5 rows of solder balls. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages | |
| type | Journal Paper | |
| journal volume | 121 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2793847 | |
| journal fristpage | 242 | |
| journal lastpage | 248 | |
| identifier eissn | 1043-7398 | |
| keywords | Cavities | |
| keywords | Flat heat pipes | |
| keywords | Ball-Grid-Array packaging | |
| keywords | Printed circuit boards | |
| keywords | Temperature distribution | |
| keywords | Thermal resistance | |
| keywords | Cooling | |
| keywords | Glass | |
| keywords | Solders AND Epoxy adhesives | |
| tree | Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 004 | |
| contenttype | Fulltext | |
