| contributor author | L. S. Fletcher | |
| contributor author | M. A. Lambert | |
| contributor author | E. E. Marotta | |
| date accessioned | 2017-05-08T23:56:14Z | |
| date available | 2017-05-08T23:56:14Z | |
| date copyright | September, 1998 | |
| date issued | 1998 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26167#229_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/120243 | |
| description abstract | The power densities and heat generation in microelectronic systems have increased dramatically as individual electronic components have been miniaturized. As a result of the growing number of thermally-induced failures in these systems, their thermal performance has become the focus of increasing concern. The use of thermally conducting interstitial coatings within and between electronic components has proven to be one technique suitable for thermal enhancement. This review will address both metallic and nonmetallic coatings suitable for thermal enhancement and discuss some of the major areas of application. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermal Enhancement Coatings for Microelectronic Systems | |
| type | Journal Paper | |
| journal volume | 120 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792627 | |
| journal fristpage | 229 | |
| journal lastpage | 237 | |
| identifier eissn | 1043-7398 | |
| keywords | Coatings | |
| keywords | Electronic components | |
| keywords | Failure AND Heat | |
| tree | Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 003 | |
| contenttype | Fulltext | |
