| contributor author | H. Doi | |
| contributor author | T. Sato | |
| contributor author | K. Kawano | |
| contributor author | A. Yasukawa | |
| date accessioned | 2017-05-08T23:56:12Z | |
| date available | 2017-05-08T23:56:12Z | |
| date copyright | December, 1998 | |
| date issued | 1998 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26169#322_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/120227 | |
| description abstract | The effect of a heat spreader on the life of the solder joints for underfill-encapsulated, flip-chip packages is investigated through stress analyses and thermal cycling tests. An underfill with suitable mechanical properties is found to be able to prolong the fatigue life of the solder joints even in a package with a heat spreader and an alumina substrate. The delamination of the underfill from the chip is revealed as another critical failure mode for which the shape of the underfill fillet has a large effect. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders | |
| type | Journal Paper | |
| journal volume | 120 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792641 | |
| journal fristpage | 322 | |
| journal lastpage | 327 | |
| identifier eissn | 1043-7398 | |
| keywords | Reliability | |
| keywords | Flip-chip devices | |
| keywords | Flat heat pipes | |
| keywords | Solder joints | |
| keywords | Delamination | |
| keywords | Shapes | |
| keywords | Stress analysis (Engineering) | |
| keywords | Mechanical properties | |
| keywords | Failure | |
| keywords | Fatigue life AND Flip-chip packages | |
| tree | Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 004 | |
| contenttype | Fulltext | |
