| contributor author | D. Yao | |
| contributor author | J. K. Shang | |
| date accessioned | 2017-05-08T23:53:13Z | |
| date available | 2017-05-08T23:53:13Z | |
| date copyright | June, 1997 | |
| date issued | 1997 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26160#114_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/118540 | |
| description abstract | Fatigue crack growth at the interface between Sn-Pb solder and Cu was examined under various mixed-mode conditions. The load-mix, in terms of the ratio of Mode-II to Mode-I stress intensities, was systematically changed by varying the thickness ratio of Cu layers in the flexural-peel specimens made from Sn-Pb/Cu joints. Fatigue crack growth experiments were conducted using a sinusoidal waveform at a frequency of 5 Hz and a load-ratio of zero. Fatigue crack growth rates were measured as a function of the total strain energy release rates for a given load-mix. Fatigue crack growth resistance was found to increase with the load-mix, with the effect of the load-mix being more pronounced in the near-threshold regime. The effect of the load-mix on fatigue crack growth is shown to result from shear-enhanced frictional sliding of fatigue crack surfaces. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Effect of Load-Mix on Fatigue Crack Growth in 63Sn-37Pb Solder Joints | |
| type | Journal Paper | |
| journal volume | 119 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792212 | |
| journal fristpage | 114 | |
| journal lastpage | 118 | |
| identifier eissn | 1043-7398 | |
| keywords | Stress | |
| keywords | Fatigue cracks AND Solder joints | |
| tree | Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 002 | |
| contenttype | Fulltext | |
