| contributor author | M. I. Campbell | |
| contributor author | C. H. Amon | |
| contributor author | J. Cagan | |
| date accessioned | 2017-05-08T23:53:13Z | |
| date available | 2017-05-08T23:53:13Z | |
| date copyright | June, 1997 | |
| date issued | 1997 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26160#106_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/118539 | |
| description abstract | This work introduces an algorithm that uses simulated annealing to perform electronic component layout while incorporating constraints related to thermal performance. A hierarchical heat transfer analysis is developed which is used in conjunction with the simulated annealing algorithm to produce final layout configurations that are densely packed and operate within specified temperature ranges. Examples of three-dimensional component placement test cases are presented including an application to embedded wearable computers. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Optimal Three-Dimensional Placement of Heat Generating Electronic Components | |
| type | Journal Paper | |
| journal volume | 119 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792210 | |
| journal fristpage | 106 | |
| journal lastpage | 113 | |
| identifier eissn | 1043-7398 | |
| keywords | Heat AND Electronic components | |
| tree | Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 002 | |
| contenttype | Fulltext | |
