Modern Solder Technology for Competitive Electronics Manufacturing
| contributor author | Jennie S. Hwang | |
| contributor author | Anthony J. Rafanelli | |
| date accessioned | 2017-05-08T23:53:11Z | |
| date available | 2017-05-08T23:53:11Z | |
| date copyright | September, 1997 | |
| date issued | 1997 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26161#214_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/118520 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Modern Solder Technology for Competitive Electronics Manufacturing | |
| type | Journal Paper | |
| journal volume | 119 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792238 | |
| journal fristpage | 214 | |
| journal lastpage | 215 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Manufacturing AND Electronics | |
| tree | Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 003 | |
| contenttype | Fulltext |
