| contributor author | A. F. Elkouh | |
| contributor author | P. S. Lee | |
| contributor author | D. Shangguan | |
| contributor author | N. Ramasubramanian | |
| contributor author | T. F. Hsu | |
| contributor author | N. J. Nigro | |
| contributor author | S. M. Heinrich | |
| date accessioned | 2017-05-08T23:53:09Z | |
| date available | 2017-05-08T23:53:09Z | |
| date copyright | December, 1997 | |
| date issued | 1997 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26163#268_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/118513 | |
| description abstract | Solutions for axisymmetric profiles of solder joints formed between a cylindrical pin and a printed circuit board (PCB) are presented. The dimensionless differential equation governing the formation of the solder joints is developed and then solved numerically for the cases of single upright joints, single inverted joints, and through-hole joints. Results are presented in terms of the following dimensionless parameters: bond number, solder volume, board thickness, and tinning radius. The dimensionless approach makes the results from this study suitable for use in a broader range of applications. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint | |
| type | Journal Paper | |
| journal volume | 119 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792248 | |
| journal fristpage | 268 | |
| journal lastpage | 274 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders AND Geometry | |
| tree | Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 004 | |
| contenttype | Fulltext | |
