| contributor author | R. J. Iannuzzelli | |
| contributor author | J. M. Pitarresi | |
| contributor author | V. Prakash | |
| date accessioned | 2017-05-08T23:49:50Z | |
| date available | 2017-05-08T23:49:50Z | |
| date copyright | June, 1996 | |
| date issued | 1996 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26154#55_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/116787 | |
| description abstract | The integrated matrix creep method for predicting the fatigue life of solder joints is presented. The application of the matrix creep life prediction method to a variety of solder joint/load combinations with a comparison to measured reliability data is presented as a validation of this technique. For a leadless chip carrier, the strain distribution in the solder is studied both through modeling and laser Moire interferometry. Finally, using this methodology as a design tool, the fatigue life simulation of a gull wing leaded package is presented in which various design parameters are modified and their effect on the fatigue life determined. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Solder Joint Reliability Prediction by the Integrated Matrix Creep Method | |
| type | Journal Paper | |
| journal volume | 118 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792132 | |
| journal fristpage | 55 | |
| journal lastpage | 61 | |
| identifier eissn | 1043-7398 | |
| keywords | Creep | |
| keywords | Reliability | |
| keywords | Solder joints | |
| keywords | Fatigue life | |
| keywords | Design | |
| keywords | Modeling | |
| keywords | Simulation | |
| keywords | Stress | |
| keywords | Lasers | |
| keywords | Interferometry | |
| keywords | Solders AND Wings | |
| tree | Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 002 | |
| contenttype | Fulltext | |
