| contributor author | John Lau | |
| contributor author | Eric Schneider | |
| contributor author | Tom Baker | |
| date accessioned | 2017-05-08T23:49:49Z | |
| date available | 2017-05-08T23:49:49Z | |
| date copyright | June, 1996 | |
| date issued | 1996 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26154#101_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/116782 | |
| description abstract | The reliability of solder bumped flip chips on organic coated copper (OCC) printed circuit board (PCB) has been studied by shock and vibration tests and a mathematical analysis. Two different chip sizes (7 mm and 14 mm on a side) have been studied, and the larger chips have many internal solder bumps. For the in-plane and out-of-plane and out-of-plane shock tests, the chips were assembled with and without underfill encapsulants. However, for the out-of-plane vibration tests all the chips were underfilled with epoxy. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards | |
| type | Journal Paper | |
| journal volume | 118 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792127 | |
| journal fristpage | 101 | |
| journal lastpage | 104 | |
| identifier eissn | 1043-7398 | |
| keywords | Copper | |
| keywords | Solders | |
| keywords | Lumber | |
| keywords | Vibration | |
| keywords | Shock (Mechanics) | |
| keywords | Flip-chip | |
| keywords | Vibration tests | |
| keywords | Flip-chip devices | |
| keywords | Mathematical analysis | |
| keywords | Printed circuit boards | |
| keywords | Epoxy adhesives AND Reliability | |
| tree | Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 002 | |
| contenttype | Fulltext | |
