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contributor authorK. W. Moon
contributor authorW. J. Boettinger
contributor authorM. E. Williams
contributor authorD. Josell
contributor authorB. T. Murray
contributor authorW. C. Carter
contributor authorC. A. Handwerker
date accessioned2017-05-08T23:49:49Z
date available2017-05-08T23:49:49Z
date copyrightSeptember, 1996
date issued1996
identifier issn1528-9044
identifier otherJEPAE4-26155#174_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/116781
description abstractThe relationships between the force measured during wetting balance tests and the observed changes of contact angle and meniscus shape are studied. Experiments using silicone oil at 25, 50, and 100°C on glass plates as well as Pb-Sn eutectic solder on Au-coated glass plates are reported. Discrepancies between the measured force and height and those expected for a static meniscus are detailed. Equilibrium meniscus shapes are computed for wide plates using the elastica solution and for narrow plates using the public-domain software package, “Surface Evolver.” For room temperature experiments with oil, the measured force discrepancy disappears when the meniscus rise is complete. Thus, the force discrepancy may be due to shear stress exerted on the sample by fluid rising up the sample. For static menisci with heated liquids, force and meniscus height discrepancies do not disappear when the meniscus rise is complete. These discrepancies can be explained by Marangoni flow due to temperature gradients in the fluid for the oil experiments but not for the solder experiments.
publisherThe American Society of Mechanical Engineers (ASME)
titleDynamic Aspects of Wetting Balance Tests
typeJournal Paper
journal volume118
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2792149
journal fristpage174
journal lastpage183
identifier eissn1043-7398
keywordsWetting (Surface science)
treeJournal of Electronic Packaging:;1996:;volume( 118 ):;issue: 003
contenttypeFulltext


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