| contributor author | J. K. Shang | |
| contributor author | Daping Yao | |
| date accessioned | 2017-05-08T23:49:49Z | |
| date available | 2017-05-08T23:49:49Z | |
| date copyright | September, 1996 | |
| date issued | 1996 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26155#170_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/116780 | |
| description abstract | The effect of interface roughness on fatigue crack growth was studied by examining the contribution of crack-surface sliding to the fatigue crack growth resistance of the interface in 63Sn-37Pb solder joints. Model interfaces with different values of roughness were produced in Sn-Pb/Cu joints by systematically varying the morphology of the intermetallic phase at the interface. Fracture mechanics analysis was conducted to calculate the crack-sliding resistance as a function of interface roughness, contact zone length, the shear strength of the solder, and elastic properties of bi-materials. The results were compared to the variation of fatigue crack growth threshold with interface morphology. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Effect of Interface Roughness on Fatigue Crack Growth in Sn-Pb Solder Joints | |
| type | Journal Paper | |
| journal volume | 118 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792148 | |
| journal fristpage | 170 | |
| journal lastpage | 173 | |
| identifier eissn | 1043-7398 | |
| keywords | Fatigue cracks | |
| keywords | Interface roughness AND Solder joints | |
| tree | Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 003 | |
| contenttype | Fulltext | |
