Development of an Integrated Design System for Thermal Reliability Prediction of SMT Solder Interconnects
| contributor author | Y.-H. Pao | |
| contributor author | E. Jih | |
| contributor author | V. Siddapureddy | |
| date accessioned | 2017-05-08T23:49:48Z | |
| date available | 2017-05-08T23:49:48Z | |
| date copyright | December, 1996 | |
| date issued | 1996 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26156#235_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/116761 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Development of an Integrated Design System for Thermal Reliability Prediction of SMT Solder Interconnects | |
| type | Journal Paper | |
| journal volume | 118 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792158 | |
| journal fristpage | 235 | |
| journal lastpage | 243 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Reliability AND Design | |
| tree | Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 004 | |
| contenttype | Fulltext |
