| contributor author | Gregory D. Leece | |
| contributor author | Ibrahim Miskioglu | |
| contributor author | David A. Nelson | |
| date accessioned | 2017-05-08T23:49:47Z | |
| date available | 2017-05-08T23:49:47Z | |
| date copyright | December, 1996 | |
| date issued | 1996 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26156#280_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/116753 | |
| description abstract | The effects of cycling frequency and temperature on the fatigue life of solder has been analyzed. Mechanical fatigue life experiments were conducted under load control while varying the temperature and cycling frequency. Using the experimental data, a fatigue model was formulated based on the Basquin and the Coffin-Manson relations, introducing the effects of temperature and frequency. The model parameters were obtained by a statistical method incorporating multiple linear regression. Using the model, estimated values of cycles to failure at each of the testing temperatures and frequency were calculated. Using the estimated values, an evaluation of each of the models was conducted, resulting in strong correlations between the model’s estimation and the experimental data. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | An Experimental Investigation of the Effects of Cycling Frequency and Temperature on the Fatigue Life of 60 Tin/40 Lead Solder | |
| type | Journal Paper | |
| journal volume | 118 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792164 | |
| journal fristpage | 280 | |
| journal lastpage | 284 | |
| identifier eissn | 1043-7398 | |
| keywords | Temperature | |
| keywords | Solders AND Fatigue life | |
| tree | Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 004 | |
| contenttype | Fulltext | |