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contributor authorGregory D. Leece
contributor authorIbrahim Miskioglu
contributor authorDavid A. Nelson
date accessioned2017-05-08T23:49:47Z
date available2017-05-08T23:49:47Z
date copyrightDecember, 1996
date issued1996
identifier issn1528-9044
identifier otherJEPAE4-26156#280_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/116753
description abstractThe effects of cycling frequency and temperature on the fatigue life of solder has been analyzed. Mechanical fatigue life experiments were conducted under load control while varying the temperature and cycling frequency. Using the experimental data, a fatigue model was formulated based on the Basquin and the Coffin-Manson relations, introducing the effects of temperature and frequency. The model parameters were obtained by a statistical method incorporating multiple linear regression. Using the model, estimated values of cycles to failure at each of the testing temperatures and frequency were calculated. Using the estimated values, an evaluation of each of the models was conducted, resulting in strong correlations between the model’s estimation and the experimental data.
publisherThe American Society of Mechanical Engineers (ASME)
titleAn Experimental Investigation of the Effects of Cycling Frequency and Temperature on the Fatigue Life of 60 Tin/40 Lead Solder
typeJournal Paper
journal volume118
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2792164
journal fristpage280
journal lastpage284
identifier eissn1043-7398
keywordsTemperature
keywordsSolders AND Fatigue life
treeJournal of Electronic Packaging:;1996:;volume( 118 ):;issue: 004
contenttypeFulltext


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