| contributor author | R. S. Figliola | |
| contributor author | P. G. Thomas | |
| date accessioned | 2017-05-08T23:46:56Z | |
| date available | 2017-05-08T23:46:56Z | |
| date copyright | March, 1995 | |
| date issued | 1995 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26147#63_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115177 | |
| description abstract | An approximate method for predicting the forced convection heat transfer for flow between parallel plates having embedded, discrete heat sources on one or both sides is presented. The spacing between sources is considered as adiabatic and the two-dimensional flow is laminar. The characteristics of such a flow can be described as flow in the isolated plate, developing flow, and fully developed flow regimes. The analysis uses appropriate forms for the surface temperature and Nusselt number solutions for the flow regimes encountered. Superposition is then applied to develop the discrete array solution for temperature and Nusselt number regardless of the arbitrary and step nature of the boundary conditions. Comparisons to existing numerical solutions show good agreement to within five percent of the predicted temperatures. A direct simulation of an existing experimental result shows reasonable agreement in the Nusselt number solution. These results validate the methodology for practical use including electronic cooling applications. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | An Approximate Method for Predicting Laminar Heat Transfer Between Parallel Plates Having Embedded Heat Sources | |
| type | Journal Paper | |
| journal volume | 117 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792068 | |
| journal fristpage | 63 | |
| journal lastpage | 68 | |
| identifier eissn | 1043-7398 | |
| keywords | Heat | |
| keywords | Heat transfer | |
| keywords | Plates (structures) | |
| keywords | Flow (Dynamics) | |
| keywords | Temperature | |
| keywords | Simulation | |
| keywords | Forced convection | |
| keywords | Boundary-value problems AND Computer cooling | |
| tree | Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 001 | |
| contenttype | Fulltext | |