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contributor authorA. A. O. Tay
contributor authorT. B. Lim
contributor authorK. S. Yeo
contributor authorJ. H. Wu
date accessioned2017-05-08T23:46:56Z
date available2017-05-08T23:46:56Z
date copyrightMarch, 1995
date issued1995
identifier issn1528-9044
identifier otherJEPAE4-26147#14_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/115171
description abstractDuring the transfer molding of IC packages, wirebonds are deformed by the action of flow-induced viscous forces acting along them. Excessive deformation of wirebonds could give rise to short circuits and bond pull-outs. In this paper, the deformation of gold wirebonds during transfer molding of IC packages is studied using the finite element method. Hitherto, only elastic deformation of wirebonds has been considered. In this paper, a more realistic elasto-plastic large-deflection model is employed. The gold wire is assumed to be made of a bilinear strain hardening material. It is shown that plastic deformation in the wirebond can occur even if the melt flowrate is not very high. However, wirebond deflection may still be within acceptable limits even though certain portions of the wirebond have yielded plastically. The deformation of parabolic wirebonds under the action of melt flow, both normal and parallel to the plane of the wirebond, is also studied. The melt flow within the cavity is simulated assuming creeping flow. Parametric studies of the effects of wirebond dimensions, namely bond height, span and wire diameter, on wirebond deformation are also carried out.
publisherThe American Society of Mechanical Engineers (ASME)
titleWirebond Deformation During Molding of IC Packages
typeJournal Paper
journal volume117
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2792061
journal fristpage14
journal lastpage19
identifier eissn1043-7398
keywordsDeformation
keywordsMolding
keywordsFlow (Dynamics)
keywordsDeflection
keywordsTransfer molding
keywordsWire
keywordsWork hardening
keywordsForce
keywordsDimensions
keywordsFinite element methods
keywordsCavities
keywordsCircuits AND Creeping flow
treeJournal of Electronic Packaging:;1995:;volume( 117 ):;issue: 001
contenttypeFulltext


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