contributor author | Edward Jih | |
contributor author | Yi-Hsin Pao | |
date accessioned | 2017-05-08T23:46:54Z | |
date available | 2017-05-08T23:46:54Z | |
date copyright | June, 1995 | |
date issued | 1995 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26149#94_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115153 | |
description abstract | Failures in electronic packaging under thermal fatigue often result from cracking in solder joints due to creep/fatigue crack growth. A nonlinear, time-dependent finite element analysis was performed to study the effect of critical design parameters on thermal reliability of leadless chip capacitor or resistor solder joints. The shear strain range based on thermal hysteresis response was used to study the sensitivity of various parameters, such as solder stand-off height, fillet geometry, Cu-pad length, and component length and thickness. The results were used as guidelines for designing reliable solder joints. In addition, an analytical model for the solder joint assembly was derived. It can be used .as an engineering approach for rapid assessment of large numbers of design parameters. The accuracy and effectiveness of the analytical model were evaluated by comparing with finite element results. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints | |
type | Journal Paper | |
journal volume | 117 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792087 | |
journal fristpage | 94 | |
journal lastpage | 99 | |
identifier eissn | 1043-7398 | |
keywords | Design | |
keywords | Resistors | |
keywords | Solder joints | |
keywords | Finite element analysis | |
keywords | Fracture (Process) | |
keywords | Failure | |
keywords | Fatigue cracks | |
keywords | Geometry | |
keywords | Creep | |
keywords | Fatigue | |
keywords | Solders | |
keywords | Manufacturing | |
keywords | Reliability | |
keywords | Electronic packaging | |
keywords | Shear (Mechanics) AND Thickness | |
tree | Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 002 | |
contenttype | Fulltext | |