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contributor authorE. P. Busso
contributor authorM. Kitano
contributor authorT. Kumazawa
date accessioned2017-05-08T23:43:58Z
date available2017-05-08T23:43:58Z
date copyrightMarch, 1994
date issued1994
identifier issn1528-9044
identifier otherJEPAE4-26141#6_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/113454
description abstractLarge scale three-dimensional finite element analyses of 68 and 44 pin types Quad Flat I-Leaded packages subjected to −55°C to 150°C temperature cycling are performed to predict the way in which inelastic strains and microstructure evolve in the solder joints. A new set of unified constitutive equations, which correctly accounts for the inelastic strain rate dependency on stress, temperature, and microstructure (internal stresses) and the evolution of the latter with deformation, was used to model the solder joints’ thermo-mechanical behavior. Estimates of the critical inelastic strain ranges in the solder joints were obtained from the calculated inelastic deformation histories. The range of inelastic strain associated with each thermal cycle is small and practically unaffected by the observed ratcheting of the cycles toward positive strains due to the non-zero mean cycle stresses. By combining the numerical results with fatigue life data obtained from leads subjected to the same thermal loading, a fatigue life relation for mean failure probability of the IC packages’ solder joints has been proposed. The analysis correctly predicts the critical locations for crack initiation.
publisherThe American Society of Mechanical Engineers (ASME)
titleModeling Complex Inelastic Deformation Processes in IC Packages’ Solder Joints
typeJournal Paper
journal volume116
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2905496
journal fristpage6
journal lastpage15
identifier eissn1043-7398
keywordsDeformation
keywordsModeling
keywordsSolder joints
keywordsCycles
keywordsTemperature
keywordsStress
keywordsFatigue life
keywordsProbability
keywordsFracture (Materials)
keywordsConstitutive equations
keywordsFinite element analysis
keywordsFailure AND Structural mechanics
treeJournal of Electronic Packaging:;1994:;volume( 116 ):;issue: 001
contenttypeFulltext


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