| contributor author | Ronald L. Linton | |
| contributor author | D. Agonafer | |
| date accessioned | 2017-05-08T23:43:57Z | |
| date available | 2017-05-08T23:43:57Z | |
| date copyright | June, 1994 | |
| date issued | 1994 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26142#134_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113448 | |
| description abstract | This paper presents an alternative approach to modeling box cooling in electronic packages. A finite-control-volume simulation code is used to simulate an IBM desktop Personal Computer. Only the geometry, the overall air flow rate, the turbulent viscosity and the power dissipations from each card must be specified. The simulation code predicts the flow distribution inside the PC, the convection coefficients, the turbulence effects, and the temperatures. Predicted component temperatures were compared to measured values. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermal Model of a PC | |
| type | Journal Paper | |
| journal volume | 116 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905501 | |
| journal fristpage | 134 | |
| journal lastpage | 137 | |
| identifier eissn | 1043-7398 | |
| keywords | Flow (Dynamics) | |
| keywords | Temperature | |
| keywords | Cooling | |
| keywords | Turbulence | |
| keywords | Viscosity | |
| keywords | Air flow | |
| keywords | Simulation | |
| keywords | Convection | |
| keywords | Modeling | |
| keywords | Computers | |
| keywords | Geometry AND Electronic packages | |
| tree | Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 002 | |
| contenttype | Fulltext | |
