| contributor author | H. D. Conway | |
| contributor author | P. Bo̸rgesen | |
| contributor author | C.-Y. Li | |
| date accessioned | 2017-05-08T23:43:57Z | |
| date available | 2017-05-08T23:43:57Z | |
| date copyright | June, 1994 | |
| date issued | 1994 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26142#110_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113444 | |
| description abstract | An elastic analysis is developed to provide estimates of the stresses in area array solder joints during thermal excursions. The analysis provides a rapid quantitative evaluation of the important stresses during elastic deformation, and may serve as a basis for the qualitative understanding of the loading of interconnects during thermal and power cycles. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Elastic Analysis of Flip-Chip Solder Joints Undergoing Thermal Excursions | |
| type | Journal Paper | |
| journal volume | 116 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905498 | |
| journal fristpage | 110 | |
| journal lastpage | 115 | |
| identifier eissn | 1043-7398 | |
| keywords | Solder joints | |
| keywords | Elastic analysis | |
| keywords | Flip-chip | |
| keywords | Stress | |
| keywords | Cycles AND Deformation | |
| tree | Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 002 | |
| contenttype | Fulltext | |
