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contributor authorWan-Lee Yin
contributor authorJames L. Dale
date accessioned2017-05-08T23:43:57Z
date available2017-05-08T23:43:57Z
date copyrightJune, 1994
date issued1994
identifier issn1528-9044
identifier otherJEPAE4-26142#105_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/113443
description abstractInterlaminar stresses near the free edge of a multi-layered structure under thermal and mechanical loads are significantly affected by nonlinear and inelastic material properties. Most previous studies of the subject ignored such effects and obtained singular or extremely severe and localized stress fields in boundary regions based strictly on the assumption of linearly elastic stress-strain relation. In the present paper, a variational method, using approximate stress functions and the principle of complementary energy, is developed to study the thermal stress in a three-layer beam including a thin, compliant, non-linearly elastic middle layer. It is found that the elastic softening behavior of the thin layer results in dispersion of the interlaminar stresses and widening of the boundary region. Hence the use of toughened, compliant bonding layers may produce a beneficial effect by alleviating local concentration of interlaminar stresses.
publisherThe American Society of Mechanical Engineers (ASME)
titleThe Effects of Adhesive Nonlinearity on Thermal Stress in Layered Components
typeJournal Paper
journal volume116
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2905497
journal fristpage105
journal lastpage109
identifier eissn1043-7398
keywordsThermal stresses
keywordsAdhesives
keywordsStress
keywordsBonding
keywordsMaterials properties
keywordsStress-strain relations AND Functions
treeJournal of Electronic Packaging:;1994:;volume( 116 ):;issue: 002
contenttypeFulltext


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