| contributor author | M. K. Schwiebert | |
| date accessioned | 2017-05-08T23:43:56Z | |
| date available | 2017-05-08T23:43:56Z | |
| date copyright | June, 1994 | |
| date issued | 1994 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26142#89_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113440 | |
| description abstract | This study considers the influence of solder joint voiding and seating plane stability on the lead standoffs of surface mount technology (SMT) solder joints. A model is presented for approximating the reaction force generated by a gas-filled void in molten solder which is compressed under an SMT lead. Seating plane stability is defined with a simple model. The lead standoffs of a component with an unstable seating plane are sensitive to small forces. For some SMT components, the reaction force generated by compressed voids in molten solder can tilt or rock a component, resulting in lead standoffs much greater than the measured lead coplanarity. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff | |
| type | Journal Paper | |
| journal volume | 116 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905510 | |
| journal fristpage | 89 | |
| journal lastpage | 91 | |
| identifier eissn | 1043-7398 | |
| keywords | Stability | |
| keywords | Solder joints | |
| keywords | Surface mount packaging | |
| keywords | Force | |
| keywords | Solders | |
| keywords | Rocks AND Surface mount technology | |
| tree | Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 002 | |
| contenttype | Fulltext | |
