| contributor author | John Lau | |
| contributor author | Suresh Golwalkar | |
| contributor author | Steve Erasmus | |
| date accessioned | 2017-05-08T23:43:55Z | |
| date available | 2017-05-08T23:43:55Z | |
| date copyright | September, 1994 | |
| date issued | 1994 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26144#234_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113433 | |
| description abstract | In this paper, the advantage of TSOP with copper leads is shown by comparing: (1) the calculated stress and strain in the solder joints with that of the TSOP with Alloy 42 lead frames (Lau et al., 1992), and (2) the experimental thermal life distribution with that of the TSOP with Alloy 42 leads (Lau et al., 1993). The disadvantage of TSOP with copper leads is shown by considering the technology limitations and manufacturing constraints. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Advantages and Disadvantages of Thin Small Outline Packages (TSOP) With Copper Gull-Wing Leads | |
| type | Journal Paper | |
| journal volume | 116 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905691 | |
| journal fristpage | 234 | |
| journal lastpage | 237 | |
| identifier eissn | 1043-7398 | |
| keywords | Copper | |
| keywords | Wings | |
| keywords | Alloys | |
| keywords | Manufacturing | |
| keywords | Stress AND Solder joints | |
| tree | Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 003 | |
| contenttype | Fulltext | |
