| contributor author | R. A. Wirtz | |
| contributor author | Weiming Chen | |
| contributor author | Ronghua Zhou | |
| date accessioned | 2017-05-08T23:43:55Z | |
| date available | 2017-05-08T23:43:55Z | |
| date copyright | September, 1994 | |
| date issued | 1994 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26144#206_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113429 | |
| description abstract | Heat transfer experiments are reported on the thermal performance of longitudinal fin heat sinks attached to an electronic package which is part of a regular array of packages undergoing forced convection air cooling. The effect of coolant bypass on the performance of the heat sink is assessed and performance correlations for reduced heat transfer due to this effect are developed. These correlations are used to develop design guidelines for optimal performance. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Effect of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks | |
| type | Journal Paper | |
| journal volume | 116 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905687 | |
| journal fristpage | 206 | |
| journal lastpage | 211 | |
| identifier eissn | 1043-7398 | |
| keywords | Flow (Dynamics) | |
| keywords | Heat sinks | |
| keywords | Heat transfer | |
| keywords | Cooling | |
| keywords | Coolants | |
| keywords | Design | |
| keywords | Forced convection AND Electronic packages | |
| tree | Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 003 | |
| contenttype | Fulltext | |
