| contributor author | B. D. Harper | |
| contributor author | J. M. Rao | |
| date accessioned | 2017-05-08T23:43:54Z | |
| date available | 2017-05-08T23:43:54Z | |
| date copyright | December, 1994 | |
| date issued | 1994 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26146#317_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113421 | |
| description abstract | Absorbed moisture is generally thought to have a plasticizing effect upon the mechanical behavior of polymers. This paper presents some experimental results illustrating the effects of water immersion upon the room temperature creep and stress-strain behavior of a polyimide film. It is shown that immersion in water results in antiplasticization as demonstrated by a significant increase in stiffness and decrease in time dependence. These effects were found to be reversible following thermal conditioning at 300°C. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Some Effects of Water Immersion on the Mechanical Behavior of a Polyimide Film | |
| type | Journal Paper | |
| journal volume | 116 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905704 | |
| journal fristpage | 317 | |
| journal lastpage | 319 | |
| identifier eissn | 1043-7398 | |
| keywords | Mechanical behavior | |
| keywords | Water | |
| keywords | Polymers | |
| keywords | Stiffness | |
| keywords | Creep | |
| keywords | Temperature AND Stress | |
| tree | Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 004 | |
| contenttype | Fulltext | |
