Notes on the First International Symposium on Microelectronic Package and PCB Technology, Beijing P. R. China
| contributor author | Zeng-Yuan Guo | |
| date accessioned | 2017-05-08T23:43:53Z | |
| date available | 2017-05-08T23:43:53Z | |
| date copyright | December, 1994 | |
| date issued | 1994 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26146#241_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113409 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Notes on the First International Symposium on Microelectronic Package and PCB Technology, Beijing P. R. China | |
| type | Journal Paper | |
| journal volume | 116 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905693 | |
| journal fristpage | 241 | |
| identifier eissn | 1043-7398 | |
| keywords | China | |
| tree | Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 004 | |
| contenttype | Fulltext |
