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contributor authorZeng-Yuan Guo
date accessioned2017-05-08T23:43:53Z
date available2017-05-08T23:43:53Z
date copyrightDecember, 1994
date issued1994
identifier issn1528-9044
identifier otherJEPAE4-26146#241_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/113409
publisherThe American Society of Mechanical Engineers (ASME)
titleNotes on the First International Symposium on Microelectronic Package and PCB Technology, Beijing P. R. China
typeJournal Paper
journal volume116
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2905693
journal fristpage241
identifier eissn1043-7398
keywordsChina
treeJournal of Electronic Packaging:;1994:;volume( 116 ):;issue: 004
contenttypeFulltext


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