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    Heat Transfer Effects During Solidification of Semicrystalline Polymers

    Source: Journal of Engineering Materials and Technology:;1993:;volume( 115 ):;issue: 001::page 30
    Author:
    M. Erhun
    ,
    S. G. Advani
    DOI: 10.1115/1.2902154
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The build-up of the residual stresses in the plastic parts are directly affected by the transient temperature distribution during the solidification stage of the semicrystalline polymers. Hence for crystallizable polymers, it is important to couple the crystallization kinetics with the transport of heat flow to determine the thermal history during solidification. In this paper, an experimental study of solidification of two semi-crystalline polymers under quiescent conditions is carried out to examine the influence of crystallization kinetics on the thermal history. The selected model materials are Nylon-66 and Poly Ethylene Terephalate (PET). The temperature profiles and the location of the solidification front are recorded during the cooling process. The experimental results are compared with the classical heat diffusion model and also with a numerical approach which couples the crystallization kinetics to the heat diffusion equation by modifying the phase change temperature based on the overall cooling rate in the crystalline domain. The front movement and the solidification temperature predictions of the coupled model are in good agreement with the experimental observations.
    keyword(s): Heat transfer , Polymers , Solidification , Crystallization , Temperature , Thermal diffusion , Cooling , Flow (Dynamics) , Heat , Equations , Temperature distribution , Temperature profiles , Residual stresses AND Nylon fabrics ,
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      Heat Transfer Effects During Solidification of Semicrystalline Polymers

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/112039
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    contributor authorM. Erhun
    contributor authorS. G. Advani
    date accessioned2017-05-08T23:41:32Z
    date available2017-05-08T23:41:32Z
    date copyrightJanuary, 1993
    date issued1993
    identifier issn0094-4289
    identifier otherJEMTA8-26954#30_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/112039
    description abstractThe build-up of the residual stresses in the plastic parts are directly affected by the transient temperature distribution during the solidification stage of the semicrystalline polymers. Hence for crystallizable polymers, it is important to couple the crystallization kinetics with the transport of heat flow to determine the thermal history during solidification. In this paper, an experimental study of solidification of two semi-crystalline polymers under quiescent conditions is carried out to examine the influence of crystallization kinetics on the thermal history. The selected model materials are Nylon-66 and Poly Ethylene Terephalate (PET). The temperature profiles and the location of the solidification front are recorded during the cooling process. The experimental results are compared with the classical heat diffusion model and also with a numerical approach which couples the crystallization kinetics to the heat diffusion equation by modifying the phase change temperature based on the overall cooling rate in the crystalline domain. The front movement and the solidification temperature predictions of the coupled model are in good agreement with the experimental observations.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleHeat Transfer Effects During Solidification of Semicrystalline Polymers
    typeJournal Paper
    journal volume115
    journal issue1
    journal titleJournal of Engineering Materials and Technology
    identifier doi10.1115/1.2902154
    journal fristpage30
    journal lastpage36
    identifier eissn1528-8889
    keywordsHeat transfer
    keywordsPolymers
    keywordsSolidification
    keywordsCrystallization
    keywordsTemperature
    keywordsThermal diffusion
    keywordsCooling
    keywordsFlow (Dynamics)
    keywordsHeat
    keywordsEquations
    keywordsTemperature distribution
    keywordsTemperature profiles
    keywordsResidual stresses AND Nylon fabrics
    treeJournal of Engineering Materials and Technology:;1993:;volume( 115 ):;issue: 001
    contenttypeFulltext
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