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contributor authorM. Erhun
contributor authorS. G. Advani
date accessioned2017-05-08T23:41:32Z
date available2017-05-08T23:41:32Z
date copyrightJanuary, 1993
date issued1993
identifier issn0094-4289
identifier otherJEMTA8-26954#30_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/112039
description abstractThe build-up of the residual stresses in the plastic parts are directly affected by the transient temperature distribution during the solidification stage of the semicrystalline polymers. Hence for crystallizable polymers, it is important to couple the crystallization kinetics with the transport of heat flow to determine the thermal history during solidification. In this paper, an experimental study of solidification of two semi-crystalline polymers under quiescent conditions is carried out to examine the influence of crystallization kinetics on the thermal history. The selected model materials are Nylon-66 and Poly Ethylene Terephalate (PET). The temperature profiles and the location of the solidification front are recorded during the cooling process. The experimental results are compared with the classical heat diffusion model and also with a numerical approach which couples the crystallization kinetics to the heat diffusion equation by modifying the phase change temperature based on the overall cooling rate in the crystalline domain. The front movement and the solidification temperature predictions of the coupled model are in good agreement with the experimental observations.
publisherThe American Society of Mechanical Engineers (ASME)
titleHeat Transfer Effects During Solidification of Semicrystalline Polymers
typeJournal Paper
journal volume115
journal issue1
journal titleJournal of Engineering Materials and Technology
identifier doi10.1115/1.2902154
journal fristpage30
journal lastpage36
identifier eissn1528-8889
keywordsHeat transfer
keywordsPolymers
keywordsSolidification
keywordsCrystallization
keywordsTemperature
keywordsThermal diffusion
keywordsCooling
keywordsFlow (Dynamics)
keywordsHeat
keywordsEquations
keywordsTemperature distribution
keywordsTemperature profiles
keywordsResidual stresses AND Nylon fabrics
treeJournal of Engineering Materials and Technology:;1993:;volume( 115 ):;issue: 001
contenttypeFulltext


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