| contributor author | J. Lau | |
| contributor author | T. Marcotte | |
| contributor author | J. Severine | |
| contributor author | A. Lee | |
| contributor author | S. Erasmus | |
| contributor author | T. Baker | |
| contributor author | J. Moldaschel | |
| contributor author | M. Sporer | |
| contributor author | G. Burward-Hoy | |
| date accessioned | 2017-05-08T23:41:02Z | |
| date available | 2017-05-08T23:41:02Z | |
| date copyright | June, 1993 | |
| date issued | 1993 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26137#180_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/111775 | |
| description abstract | The solder joint reliability of five different surface mount connectors has been studied by eleven different experimental methods. A set of test methods and specifications for determining the reliability of the solder joints of surface mount connectors has been recommended. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Solder Joint Reliability of Surface Mount Connectors | |
| type | Journal Paper | |
| journal volume | 115 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2909315 | |
| journal fristpage | 180 | |
| journal lastpage | 188 | |
| identifier eissn | 1043-7398 | |
| keywords | Reliability | |
| keywords | Solder joints | |
| keywords | Surface mount packaging AND Experimental methods | |
| tree | Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 002 | |
| contenttype | Fulltext | |
