| contributor author | S. F. Popelar | |
| contributor author | C. H. Popelar | |
| contributor author | V. H. Kenner | |
| date accessioned | 2017-05-08T23:40:59Z | |
| date available | 2017-05-08T23:40:59Z | |
| date copyright | September, 1993 | |
| date issued | 1993 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26139#264_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/111755 | |
| description abstract | A fracture mechanics approach for quantifying slow crack growth in thin polyimide films and assessing their structural integrity and life expectancy is presented. The methodology and techniques developed in this investigation may also be applied to other polymeric materials. A test protocol for studying slow crack growth is described. Room temperature fracture tests were performed and an analysis model was developed and validated to analyze the fracture tests. Correlations between the rate of crack growth and the crack driving force as measured by the stress intensity factor were made and contrasted for Kapton 100HN, 300H and 500HN polyimide films. The crack growth rate was found to depend very strongly upon the stress intensity factor. The practical implication of this finding is that the fracture of these polyimide films may be approximated as being controlled by a critical value of the stress intensity factor. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Time-Dependent Fracture of Polyimide Films | |
| type | Journal Paper | |
| journal volume | 115 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2909327 | |
| journal fristpage | 264 | |
| journal lastpage | 269 | |
| identifier eissn | 1043-7398 | |
| keywords | Fracture (Process) | |
| keywords | Stress | |
| keywords | Force | |
| keywords | Fracture mechanics AND Temperature | |
| tree | Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 003 | |
| contenttype | Fulltext | |
