| contributor author | S. K. Rastogi | |
| contributor author | D. Poulikakos | |
| date accessioned | 2017-05-08T23:40:58Z | |
| date available | 2017-05-08T23:40:58Z | |
| date copyright | December, 1993 | |
| date issued | 1993 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26140#373_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/111736 | |
| description abstract | In this paper a heat transfer model is presented for the determination of the temperature field of a circuit board with electronic components placed upon it and undergoing the process of surface mounting. The model is solved for a simple board configuration and the effect of the major parameters of the problem on the temperature field of the board and the components is obtained. Regions of sharp thermal gradients (causing thermal stresses and possible cracking) are identified. These regions are usually located around the edges of the electronic components as well as underneath the edges of these components within the board material. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Modeling of Heat Transfer in the Surface Mounting of Electronic Components | |
| type | Journal Paper | |
| journal volume | 115 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2909346 | |
| journal fristpage | 373 | |
| journal lastpage | 381 | |
| identifier eissn | 1043-7398 | |
| keywords | Heat transfer | |
| keywords | Electronic components | |
| keywords | Modeling | |
| keywords | Temperature | |
| keywords | Circuits | |
| keywords | Temperature gradients | |
| keywords | Fracture (Process) AND Thermal stresses | |
| tree | Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 004 | |
| contenttype | Fulltext | |
