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    A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints

    Source: Journal of Engineering Materials and Technology:;1992:;volume( 114 ):;issue: 003::page 331
    Author:
    E. P. Busso
    ,
    M. Kitano
    ,
    T. Kumazawa
    DOI: 10.1115/1.2904181
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A new unified visco-plastic constitutive model for the 60 Sn-40 Pb alloy used in solder joints of surface-mount IC packages and semiconductor devices is proposed. The model accounts for the measured stress-dependence of the activation energy and for the strong Bauschinger effect exhibited by the solder. The latter is represented by a back stress state variable which, in turn, evolves according to a hardening-recovery equation. Based on the observed hardening behavior, it is assumed that the isotropic resistance to plastic flow does not evolve within the deformation range covered in this study (ε< 3 percent). The deformation phenomena associated with the solder’s monotonic and steady-state cyclic responses are accurately predicted for −55°C≦T≦150°C and 8 x 10−2 s−1 ≦ ε ≦ 8 x 10−5 s−1 . The model also predicts well the overall trend of steady-state creep behavior. The constitutive model is formulated within a continuum mechanics framework and is therefore well suited for implementation into finite element or other structural codes.
    keyword(s): Solders , Constitutive equations , Deformation , Stress , Hardening , Steady state , Surface mount packaging , Continuum mechanics , Creep , Semiconductors (Materials) , Electrical resistance , Lead alloys , Finite element analysis , Equations AND Solder joints ,
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      A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/110327
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    • Journal of Engineering Materials and Technology

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    contributor authorE. P. Busso
    contributor authorM. Kitano
    contributor authorT. Kumazawa
    date accessioned2017-05-08T23:38:34Z
    date available2017-05-08T23:38:34Z
    date copyrightJuly, 1992
    date issued1992
    identifier issn0094-4289
    identifier otherJEMTA8-26951#331_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110327
    description abstractA new unified visco-plastic constitutive model for the 60 Sn-40 Pb alloy used in solder joints of surface-mount IC packages and semiconductor devices is proposed. The model accounts for the measured stress-dependence of the activation energy and for the strong Bauschinger effect exhibited by the solder. The latter is represented by a back stress state variable which, in turn, evolves according to a hardening-recovery equation. Based on the observed hardening behavior, it is assumed that the isotropic resistance to plastic flow does not evolve within the deformation range covered in this study (ε< 3 percent). The deformation phenomena associated with the solder’s monotonic and steady-state cyclic responses are accurately predicted for −55°C≦T≦150°C and 8 x 10−2 s−1 ≦ ε ≦ 8 x 10−5 s−1 . The model also predicts well the overall trend of steady-state creep behavior. The constitutive model is formulated within a continuum mechanics framework and is therefore well suited for implementation into finite element or other structural codes.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints
    typeJournal Paper
    journal volume114
    journal issue3
    journal titleJournal of Engineering Materials and Technology
    identifier doi10.1115/1.2904181
    journal fristpage331
    journal lastpage337
    identifier eissn1528-8889
    keywordsSolders
    keywordsConstitutive equations
    keywordsDeformation
    keywordsStress
    keywordsHardening
    keywordsSteady state
    keywordsSurface mount packaging
    keywordsContinuum mechanics
    keywordsCreep
    keywordsSemiconductors (Materials)
    keywordsElectrical resistance
    keywordsLead alloys
    keywordsFinite element analysis
    keywordsEquations AND Solder joints
    treeJournal of Engineering Materials and Technology:;1992:;volume( 114 ):;issue: 003
    contenttypeFulltext
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