contributor author | E. P. Busso | |
contributor author | M. Kitano | |
contributor author | T. Kumazawa | |
date accessioned | 2017-05-08T23:38:34Z | |
date available | 2017-05-08T23:38:34Z | |
date copyright | July, 1992 | |
date issued | 1992 | |
identifier issn | 0094-4289 | |
identifier other | JEMTA8-26951#331_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/110327 | |
description abstract | A new unified visco-plastic constitutive model for the 60 Sn-40 Pb alloy used in solder joints of surface-mount IC packages and semiconductor devices is proposed. The model accounts for the measured stress-dependence of the activation energy and for the strong Bauschinger effect exhibited by the solder. The latter is represented by a back stress state variable which, in turn, evolves according to a hardening-recovery equation. Based on the observed hardening behavior, it is assumed that the isotropic resistance to plastic flow does not evolve within the deformation range covered in this study (ε< 3 percent). The deformation phenomena associated with the solder’s monotonic and steady-state cyclic responses are accurately predicted for −55°C≦T≦150°C and 8 x 10−2 s−1 ≦ ε ≦ 8 x 10−5 s−1 . The model also predicts well the overall trend of steady-state creep behavior. The constitutive model is formulated within a continuum mechanics framework and is therefore well suited for implementation into finite element or other structural codes. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints | |
type | Journal Paper | |
journal volume | 114 | |
journal issue | 3 | |
journal title | Journal of Engineering Materials and Technology | |
identifier doi | 10.1115/1.2904181 | |
journal fristpage | 331 | |
journal lastpage | 337 | |
identifier eissn | 1528-8889 | |
keywords | Solders | |
keywords | Constitutive equations | |
keywords | Deformation | |
keywords | Stress | |
keywords | Hardening | |
keywords | Steady state | |
keywords | Surface mount packaging | |
keywords | Continuum mechanics | |
keywords | Creep | |
keywords | Semiconductors (Materials) | |
keywords | Electrical resistance | |
keywords | Lead alloys | |
keywords | Finite element analysis | |
keywords | Equations AND Solder joints | |
tree | Journal of Engineering Materials and Technology:;1992:;volume( 114 ):;issue: 003 | |
contenttype | Fulltext | |