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contributor authorE. P. Busso
contributor authorM. Kitano
contributor authorT. Kumazawa
date accessioned2017-05-08T23:38:34Z
date available2017-05-08T23:38:34Z
date copyrightJuly, 1992
date issued1992
identifier issn0094-4289
identifier otherJEMTA8-26951#331_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110327
description abstractA new unified visco-plastic constitutive model for the 60 Sn-40 Pb alloy used in solder joints of surface-mount IC packages and semiconductor devices is proposed. The model accounts for the measured stress-dependence of the activation energy and for the strong Bauschinger effect exhibited by the solder. The latter is represented by a back stress state variable which, in turn, evolves according to a hardening-recovery equation. Based on the observed hardening behavior, it is assumed that the isotropic resistance to plastic flow does not evolve within the deformation range covered in this study (ε< 3 percent). The deformation phenomena associated with the solder’s monotonic and steady-state cyclic responses are accurately predicted for −55°C≦T≦150°C and 8 x 10−2 s−1 ≦ ε ≦ 8 x 10−5 s−1 . The model also predicts well the overall trend of steady-state creep behavior. The constitutive model is formulated within a continuum mechanics framework and is therefore well suited for implementation into finite element or other structural codes.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints
typeJournal Paper
journal volume114
journal issue3
journal titleJournal of Engineering Materials and Technology
identifier doi10.1115/1.2904181
journal fristpage331
journal lastpage337
identifier eissn1528-8889
keywordsSolders
keywordsConstitutive equations
keywordsDeformation
keywordsStress
keywordsHardening
keywordsSteady state
keywordsSurface mount packaging
keywordsContinuum mechanics
keywordsCreep
keywordsSemiconductors (Materials)
keywordsElectrical resistance
keywordsLead alloys
keywordsFinite element analysis
keywordsEquations AND Solder joints
treeJournal of Engineering Materials and Technology:;1992:;volume( 114 ):;issue: 003
contenttypeFulltext


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