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contributor authorA. M. Anderson
contributor authorR. J. Moffat
date accessioned2017-05-08T23:38:09Z
date available2017-05-08T23:38:09Z
date copyrightMarch, 1992
date issued1992
identifier issn1528-9044
identifier otherJEPAE4-26127#22_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110091
description abstractThis paper describes an investigation of the forced convection heat transfer and pressure drop characteristics of a regular in-line array of flatpacks for several channel heights and inlet velocities. The work has both practical and theoretical interest since it relates to technical problems now faced by the electronics industry, and it embodies one of the most general heat transfer problems: nonuniform heat release from nonuniform geometries. To predict operating temperatures in situations where the wall temperature distribution is nonuniform, one must use superposition. Both the adiabatic heat transfer coefficient, h ad and the superposition kernel functions, g * are required. The problem can be solved using superposition directly (h ad and g *) or indirectly (using h ad and g * to calculate the correct value of h m ). Either way the superposition data is required. This work presents the first full set of superposition data for flatpack arrays. Part 1 presents heat transfer and pressure drop results and part 2 presents a model for heat transfer that is based on the maximum turbulence fluctuations in the channel.
publisherThe American Society of Mechanical Engineers (ASME)
titleThe Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 2—Modeling Flatpack Data as a Function of Channel Turbulence
typeJournal Paper
journal volume114
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2905437
journal fristpage22
journal lastpage28
identifier eissn1043-7398
keywordsChannels (Hydraulic engineering)
keywordsTurbulence
keywordsModeling
keywordsHeat transfer coefficients
keywordsHeat transfer
keywordsPressure drop
keywordsWall temperature
keywordsElectronics
keywordsOperating temperature
keywordsHeat
keywordsFunctions
keywordsFluctuations (Physics) AND Forced convection
treeJournal of Electronic Packaging:;1992:;volume( 114 ):;issue: 001
contenttypeFulltext


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