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contributor authorS. V. Garimella
contributor authorP. A. Eibeck
date accessioned2017-05-08T23:38:09Z
date available2017-05-08T23:38:09Z
date copyrightJune, 1992
date issued1992
identifier issn1528-9044
identifier otherJEPAE4-26129#251_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110085
description abstractOnset of transition is investigated in the flow over an array of protruding elements mounted on the bottom wall of a rectangular water channel simulating flow passages between adjacent circuit boards in computers. The element dimensions are held constant while the channel height and the element spacing are varied. Flow visualization and turbulence measurements are used to determine transition Reynolds numbers, which compare well with previous results obtained from heat transfer data. The complicated, three-dimensional flow field causes transition to be a function not only of flow rate and array geometry but also of location in the array. Transition occurs in the fully developed region of the array at a channel height-based Reynolds number of 700 for a channel height of 1.2 element heights, increasing to 1900 for a channel height of 3.6 element heights. However, when Reynolds number is defined based on element height, transition occurs at the same Reynolds number of 550 for all channel heights. Increasing the stream wise spacing between elements causes transition to occur at lower Reynolds numbers.
publisherThe American Society of Mechanical Engineers (ASME)
titleOnset of Transition in the Flow Over a Three-Dimensional Array of Rectangular Obstacles
typeJournal Paper
journal volume114
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2906426
journal fristpage251
journal lastpage255
identifier eissn1043-7398
keywordsFlow (Dynamics)
keywordsChannels (Hydraulic engineering)
keywordsReynolds number
keywordsLumber
keywordsFlow visualization
keywordsComputers
keywordsCircuits
keywordsGeometry
keywordsWater
keywordsMeasurement
keywordsTurbulence
keywordsDimensions AND Heat transfer
treeJournal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002
contenttypeFulltext


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