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    Bonded Bi-material Half-Planes With Semi-elliptical Notch Under Tension Along the Interface

    Source: Journal of Applied Mechanics:;1992:;volume( 059 ):;issue: 001::page 77
    Author:
    Norio Hasebe
    ,
    Mikiya Okumura
    ,
    Takuji Nakamura
    DOI: 10.1115/1.2899467
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A problem of two bonded, dissimilar half-planes containing an elliptical hole on the interface is solved. The external load is uniform tension parallel to the interface. A rational mapping function and complex stress functions are used and an analytical solution is obtained. Stress distributions are shown. Stress concentration factors are also obtained for arbitrary lengths of debonding and for several material constants. In addition, an approximate expression of the stress concentration factor is given for elliptical holes and the accuracy is investigated.
    keyword(s): Tension , Stress , Stress concentration AND Functions ,
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      Bonded Bi-material Half-Planes With Semi-elliptical Notch Under Tension Along the Interface

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/109771
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    contributor authorNorio Hasebe
    contributor authorMikiya Okumura
    contributor authorTakuji Nakamura
    date accessioned2017-05-08T23:37:36Z
    date available2017-05-08T23:37:36Z
    date copyrightMarch, 1992
    date issued1992
    identifier issn0021-8936
    identifier otherJAMCAV-26337#77_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/109771
    description abstractA problem of two bonded, dissimilar half-planes containing an elliptical hole on the interface is solved. The external load is uniform tension parallel to the interface. A rational mapping function and complex stress functions are used and an analytical solution is obtained. Stress distributions are shown. Stress concentration factors are also obtained for arbitrary lengths of debonding and for several material constants. In addition, an approximate expression of the stress concentration factor is given for elliptical holes and the accuracy is investigated.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleBonded Bi-material Half-Planes With Semi-elliptical Notch Under Tension Along the Interface
    typeJournal Paper
    journal volume59
    journal issue1
    journal titleJournal of Applied Mechanics
    identifier doi10.1115/1.2899467
    journal fristpage77
    journal lastpage83
    identifier eissn1528-9036
    keywordsTension
    keywordsStress
    keywordsStress concentration AND Functions
    treeJournal of Applied Mechanics:;1992:;volume( 059 ):;issue: 001
    contenttypeFulltext
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