| contributor author | G. L. Lehmann | |
| contributor author | J. Pembroke | |
| date accessioned | 2017-05-08T23:35:19Z | |
| date available | 2017-05-08T23:35:19Z | |
| date copyright | March, 1991 | |
| date issued | 1991 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26121#21_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/108411 | |
| description abstract | Forced convection cooling of a simulated array of card-mounted electronic components has been investigated. An important feature of the simulated components is their relatively low profile (height/length = 0.058). Laboratory measurements of heat transfer rates resulting from convective air flow through a low aspect ratio channel are reported. The effect of variations in array position, channel spacing and flow rate is discussed. In the flow range considered laminar, transitional and turbulent heat transfer behavior have been observed. The behavior due to variations in flow rate and channel spacing is well correlated using a Reynolds number based on component length. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Forced Convection Air Cooling of Simulated Low Profile Electronic Components: Part 1—Base Case | |
| type | Journal Paper | |
| journal volume | 113 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905361 | |
| journal fristpage | 21 | |
| journal lastpage | 26 | |
| identifier eissn | 1043-7398 | |
| keywords | Cooling | |
| keywords | Electronic components | |
| keywords | Forced convection | |
| keywords | Flow (Dynamics) | |
| keywords | Channels (Hydraulic engineering) | |
| keywords | Measurement | |
| keywords | Air flow | |
| keywords | Reynolds number | |
| keywords | Heat transfer AND Turbulent heat transfer | |
| tree | Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 001 | |
| contenttype | Fulltext | |
