| contributor author | I. Sharif | |
| contributor author | D. B. Barker | |
| contributor author | A. Dasgupta | |
| contributor author | M. G. Pecht | |
| date accessioned | 2017-05-08T23:35:19Z | |
| date available | 2017-05-08T23:35:19Z | |
| date copyright | June, 1991 | |
| date issued | 1991 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26122#194_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/108406 | |
| description abstract | This paper discusses the thermo-mechanical fatigue life analysis of an analog Avantek Planarpak™ surface mount device where the entire base of the component is soldered directly to the printed wiring board. The critical thermal stresses and strains are analyzed with the help of two and three-dimensional finite element models. The effect of solder voids and incomplete bonding is also investigated. The paper also shows how fatigue life estimations can be made using q generalized form of the Manson-Coffin equation even though the maximum solder attach stresses are found to be elastic. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Fatigue Analysis of a Planarpak™ Surface Mount Component | |
| type | Journal Paper | |
| journal volume | 113 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905387 | |
| journal fristpage | 194 | |
| journal lastpage | 199 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Bonding | |
| keywords | Stress | |
| keywords | Thermal stresses | |
| keywords | Approximation | |
| keywords | Equations | |
| keywords | Fatigue analysis | |
| keywords | Fatigue life | |
| keywords | Finite element model | |
| keywords | Printed circuit boards | |
| keywords | Surface mount packaging AND Surface mount devices | |
| tree | Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 002 | |
| contenttype | Fulltext | |
