The Solder Joint Fatigue Life Acceleration Factor
| contributor author | H. D. Solomon | |
| date accessioned | 2017-05-08T23:35:18Z | |
| date available | 2017-05-08T23:35:18Z | |
| date copyright | June, 1991 | |
| date issued | 1991 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26122#186_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/108404 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | The Solder Joint Fatigue Life Acceleration Factor | |
| type | Journal Paper | |
| journal volume | 113 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905385 | |
| journal fristpage | 186 | |
| journal lastpage | 190 | |
| identifier eissn | 1043-7398 | |
| keywords | Fatigue life AND Solder joints | |
| tree | Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 002 | |
| contenttype | Fulltext |
