| contributor author | Z. Mei | |
| contributor author | M. C. Shine | |
| contributor author | J. W. Morris | |
| date accessioned | 2017-05-08T23:35:18Z | |
| date available | 2017-05-08T23:35:18Z | |
| date copyright | June, 1991 | |
| date issued | 1991 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26122#109_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/108393 | |
| description abstract | The creep behavior of air-cooled and liquid nitrogen-quenched soldered joints of 60/40 Sn-Pb at 65°C has been studied. The stress exponent, n, in the power law, γ̇ (steady state strain rate) ∝σn (applied stress), changes from a value of about 6 to values of 2 to 3, as γ̇ decreases below 10−4 in/in per second. This result, combined with the authors’ previous stepped load creep test results, indicates a transition of the creep deformation mechanism from conventional dislocation climb to superplastic grain boundary sliding. The superplastic creep of the soldered joints is ascribed to their non-lamellar microstructure due to their fast cooling rate. During creep deformation, recrystallization of the soldered joints occurs, causing softening. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Superplastic Creep of Eutectic Tin-Lead Solder Joints | |
| type | Journal Paper | |
| journal volume | 113 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905375 | |
| journal fristpage | 109 | |
| journal lastpage | 114 | |
| identifier eissn | 1043-7398 | |
| keywords | Creep | |
| keywords | Superplasticity | |
| keywords | Solder joints | |
| keywords | Stress | |
| keywords | Dislocations | |
| keywords | Nitrogen | |
| keywords | Cooling | |
| keywords | Grain boundaries | |
| keywords | Recrystallization | |
| keywords | Steady state AND Mechanisms | |
| tree | Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 002 | |
| contenttype | Fulltext | |
