| contributor author | R. J. Krane | |
| contributor author | T. J. Phillips | |
| date accessioned | 2017-05-08T23:35:15Z | |
| date available | 2017-05-08T23:35:15Z | |
| date copyright | September, 1991 | |
| date issued | 1991 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26123#301_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/108383 | |
| description abstract | This investigation consisted of an experimental study of the natural convection heat transfer from a square, horizontally oriented electronic component board mounted in a low-aspect-ratio enclosure with a square planform. The component board was simulated by an upward-facing constant heat flux surface. A variety of experiments were performed to determine the effects of systematically varying the enclosure geometry on the maximum surface temperature on the board for two values of the modified Rayleigh number (heater power setting). | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Natural Convection Cooling of a Horizontally Oriented Component Board Mounted in a Low-Aspect-Ratio Enclosure | |
| type | Journal Paper | |
| journal volume | 113 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905410 | |
| journal fristpage | 301 | |
| journal lastpage | 308 | |
| identifier eissn | 1043-7398 | |
| keywords | Cooling AND Natural convection | |
| tree | Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 003 | |
| contenttype | Fulltext | |
