contributor author | Mingguang Zhu | |
contributor author | D. D. L. Chung | |
date accessioned | 2017-05-08T23:35:12Z | |
date available | 2017-05-08T23:35:12Z | |
date copyright | December, 1991 | |
date issued | 1991 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26124#417_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/108362 | |
description abstract | Short nickel fiber silicone-matrix composites containing 3–12 vol. percent fibers were fabricated by the impregnation of silicone into a nickel fiber perform. The composites exhibited volume electrical resistivity ranging from 4.5 × 10−4 to 2.8 × 10−3 ohm.cm, contact electrical resistivity (with copper at a pressure > 0.1 MPa) ranging from 0.0090 to 0.0155 ohm.cm2 , permanent set one percent after compression to a stress of 0.4 MPa and a strain up to 13.5 percent for 7 days, and electromagnetic interference (EMI) shielding effectiveness > 50 dB at 1.0–2.0 GHz. The volume and contact resistivities were essentially not affected after heating in air at 130–150°C for 7 days. The coefficient of thermal expansion was 27.5 × 10−6 °C−1 for a composite containing 8.2 vol. percent nickel fibers. These resilient electrically conducting composites are useful for electrical contacts and for gaskets for EMI shielding. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Nickel Fiber Silicone-Matrix Composites as Resilient Electrical Conductors | |
type | Journal Paper | |
journal volume | 113 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2905429 | |
journal fristpage | 417 | |
journal lastpage | 420 | |
identifier eissn | 1043-7398 | |
keywords | Nickel | |
keywords | Composite materials | |
keywords | Fibers | |
keywords | Silicones | |
keywords | Electrical resistivity | |
keywords | Heating | |
keywords | Pressure | |
keywords | Thermal expansion | |
keywords | Copper | |
keywords | Electromagnetic interference | |
keywords | Stress | |
keywords | Gaskets AND Compression | |
tree | Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 004 | |
contenttype | Fulltext | |