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    Three-Dimensional Stress Fields of Elastic Interface Cracks

    Source: Journal of Applied Mechanics:;1991:;volume( 058 ):;issue: 004::page 939
    Author:
    T. Nakamura
    DOI: 10.1115/1.2897711
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Various aspects of stress fields near an interface crack in three-dimensional bimaterial plates are investigated. Due to the nature of the resulting deformation field, three-dimensional effects are more critical in a bimaterial plate than in a homogeneous plate. In the close vicinity of the crack front, the stress field is characterized by the asymptotic bimaterial K -field, and its domain size is a very small fraction of a plate thickness. Unlike a homogeneous case, the asymptotic field always consists all three modes of fracture, and an interface crack must propagate under mixed-mode conditions. Furthermore, computational results have shown that the two phase angles representing the relative magnitudes of the three modes strongly depend on the bimaterial properties. It has been also observed that a significant antiplane (Mode III) deformation exists along the crack front, especially near the free surface. Since experimental investigations have shown that critical energy release rate G c is highly dependent on the phase angles, accurate prediction of the interface fracture behavior requires not only the G distribution but also the variations of phase angles along the crack front.
    keyword(s): Stress , Fracture (Materials) , Fracture (Process) , Deformation , Plates (structures) AND Thickness ,
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      Three-Dimensional Stress Fields of Elastic Interface Cracks

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    http://yetl.yabesh.ir/yetl1/handle/yetl/107934
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    contributor authorT. Nakamura
    date accessioned2017-05-08T23:34:28Z
    date available2017-05-08T23:34:28Z
    date copyrightDecember, 1991
    date issued1991
    identifier issn0021-8936
    identifier otherJAMCAV-26335#939_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/107934
    description abstractVarious aspects of stress fields near an interface crack in three-dimensional bimaterial plates are investigated. Due to the nature of the resulting deformation field, three-dimensional effects are more critical in a bimaterial plate than in a homogeneous plate. In the close vicinity of the crack front, the stress field is characterized by the asymptotic bimaterial K -field, and its domain size is a very small fraction of a plate thickness. Unlike a homogeneous case, the asymptotic field always consists all three modes of fracture, and an interface crack must propagate under mixed-mode conditions. Furthermore, computational results have shown that the two phase angles representing the relative magnitudes of the three modes strongly depend on the bimaterial properties. It has been also observed that a significant antiplane (Mode III) deformation exists along the crack front, especially near the free surface. Since experimental investigations have shown that critical energy release rate G c is highly dependent on the phase angles, accurate prediction of the interface fracture behavior requires not only the G distribution but also the variations of phase angles along the crack front.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThree-Dimensional Stress Fields of Elastic Interface Cracks
    typeJournal Paper
    journal volume58
    journal issue4
    journal titleJournal of Applied Mechanics
    identifier doi10.1115/1.2897711
    journal fristpage939
    journal lastpage946
    identifier eissn1528-9036
    keywordsStress
    keywordsFracture (Materials)
    keywordsFracture (Process)
    keywordsDeformation
    keywordsPlates (structures) AND Thickness
    treeJournal of Applied Mechanics:;1991:;volume( 058 ):;issue: 004
    contenttypeFulltext
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