| contributor author | Boon Wong | |
| contributor author | D. E. Helling | |
| date accessioned | 2017-05-08T23:32:24Z | |
| date available | 2017-05-08T23:32:24Z | |
| date copyright | June, 1990 | |
| date issued | 1990 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26116#104_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/106777 | |
| description abstract | A mechanistic model for eutectic Pb/Sn solder life predictions has been developed and applied to leadless surface mount solder joints. This model can quantitatively describe both crack initiation and crack propagation processes in the solder. There are four parts to this model: a crack initiation model, a crack propagation model [1], a microstructural coarsening model and an analysis of the deformation in the solder during thermal cycling. By merging these models together, it is possible to predict the time to crack initiation and the time to failure of these solder joints. Solder joint life predictions show good agreement with data obtained on thermally cycled surface mount leadless chip resistors. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A Mechanistic Model for Solder Joint Failure Prediction Under Thermal Cycling | |
| type | Journal Paper | |
| journal volume | 112 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2904349 | |
| journal fristpage | 104 | |
| journal lastpage | 109 | |
| identifier eissn | 1043-7398 | |
| keywords | Failure | |
| keywords | Solder joints | |
| keywords | Solders | |
| keywords | Fracture (Materials) | |
| keywords | Crack propagation | |
| keywords | Surface mount packaging | |
| keywords | Deformation AND Resistors | |
| tree | Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 002 | |
| contenttype | Fulltext | |
