| contributor author | S. M. Heinrich | |
| contributor author | N. J. Nigro | |
| contributor author | P. S. Lee | |
| contributor author | A. F. Elkouh | |
| date accessioned | 2017-05-08T23:32:22Z | |
| date available | 2017-05-08T23:32:22Z | |
| date copyright | September, 1990 | |
| date issued | 1990 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26117#219_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/106762 | |
| description abstract | In this paper dimensionless design curves relating fillet height and length to joint cross-sectional area are presented for surface-mount solder joints. Based on an analytical surface tension model, the advantage of these dimensionless curves is that they may be used for arbitrary values of solder density and surface tension. The range of applicability of previously developed approximate formulae for predicting joint dimensions is also investigated. A simple example problem is included to illustrate the use of both the design curves and the approximate formulae. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Solder Joint Formation in Surface Mount Technology—Part II: Design | |
| type | Journal Paper | |
| journal volume | 112 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2904370 | |
| journal fristpage | 219 | |
| journal lastpage | 222 | |
| identifier eissn | 1043-7398 | |
| keywords | Design | |
| keywords | Solder joints | |
| keywords | Surface mount technology | |
| keywords | Formulas | |
| keywords | Surface tension | |
| keywords | Solders | |
| keywords | Dimensions | |
| keywords | Density AND Surface mount packaging | |
| tree | Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 003 | |
| contenttype | Fulltext | |
